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mlx81100 dc-motor controller mlx81100 ? product abstract page 1 of 19 june 2012 rev 021 features cpu o melexcm cpu (dual risc cpu ? 5mips) o lin protocol controller o 16-bit application cpu90 o internal rc-oscillator memories o 2kbyte ram, 30kbyte flash, 128 byte eeprom o flash for series production periphery o three 16-bit timer with capture and compare o full duplex spi interface o 100-kbaud uart o 2 high and 2 low side fet driver with protection o over temperature control o short circuit protection o current control o 8-bit pwm control with programmable base frequency of 100hz to 100khz o 8 high voltage i/os o 16-channel 10-bit adc with high voltage option o independent analog watchdog o temperature sensor voltage regulator o direct powered from 12v boardnet with low voltage d etection o operating voltage v s = 7.3v to 18v o external load transistor for higher 5v loads or hig her ambient temperature possible o very low standby current, < 50a in sleep mode bus interface o lin transceiver o supporting of lin 2.x and sae j2602 o lin protocol software provided by melexis o wake up by lin traffic or local sources additional features o on-chip cpu debugger o jump start and 45v load dump protected o available in two package variants qfn 6x6 40 and tq fp ep 48l
mlx81100 dc-motor controller mlx81100 ? product abstract page 2 of 19 june 2012 rev 021 applications lin slaves for all kind of high current dc motor wi th full bridge fet control like o wiper control o valve control o seat movement o pumps ordering information order code temp. range (k) package (lq or pf) delivery option (re, tu, tr) mlx81100klq baa 000 tu 40c 125c qfn406x6 tube mlx81100klq baa 000 re 40c125c qfn406x6 reel mlx81100kpf baa 000 tr 40c125c tqfp487x7ep tray mlx81100kpf baa 000 re 40c125c tqfp487x7ep reel ordering example: mlx81100klq-baa-000-tu
mlx81100 dc-motor controller mlx81100 ? product abstract page 3 of 19 june 2012 rev 021 contents 1. functional diagram ................................ ................................................... ..................................... 4 2. electrical characteristics ........................ ................................................... ............................. 5 2.1 o perating c onditions .................................................. ................................................... ............... 5 2.2 a bsolute m aximum r atings .................................................. ................................................... ....... 6 3. application circuitry ............................. ................................................... ..................................... 7 3.1 s ingle dc-m otor d rive .................................................. ................................................... ............. 7 3.2 h igher vcc l oads and higher a mbient t emperatures .................................................. .............. 8 3.3 h igh s ide r everse p olarity p rotection .................................................. ..................................... 8 3.4 c onnection to e xternal can c ontroller .................................................. ................................. 9 3.5 d ual dc-m otor d rive ................................................... ................................................... ............. 10 3.6 h uman i nterface d evice with dc-m otor .................................................. .................................. 11 3.7 s eat h eating and c limatisation .................................................. ................................................. 1 2 4. pin description ................................... ................................................... .......................................... 13 5. mechanical specification .......................... ................................................... .............................. 15 5.1 qfn 6 x 6 40 sawn .................................................. ................................................... ...................... 15 5.2 tqfp 7 x 7 ep 48l ............................................... ................................................... ......................... 16 6. standard information regarding manufacturability of melexis products with different soldering processes ..................... ................................................... ............................... 17 7. disclaimer ........................................ ................................................... ............................................... 19
mlx81100 dc-motor controller mlx81100 ? product abstract page 4 of 19 june 2012 rev 021 1. functional diagram figure 1- block diagram comm. cpu mlx4 lin-sbi (1.3 and 2.0) lin- phy ram 2kbyte mm u eeprom 128byte watchdog multi- cpu debugger 10 bit adc flash 32kbyte with ecc 5v/1.8v supply aux. supply vs v1v8 lin vdrv gnd melexcm pwmo 8 bit counter with period register compare on/off clock devider f pll 8 bit counter with period register compare on/off clock devider 8 bit counter with period register compare on/off clock devider pwm control 50hz...100khz test controller appl. cpu mlx16 pll 30mhz f rc interrrupt controller f osc f pll 16 bit timer dual compare dual capture prescaler f osc, f osc /16 , f osc /256 16 bit timer dual compare dual capture prescaler f osc, f osc /16 , f osc /256 16 bit timer dual compare dual capture prescaler f osc, f osc /16 , f osc /256 f pll spi uart ti0 ti1 to internal communication interface internal communication interface voltage monitor temp pre- driver high side 1 hsbc1 hs1 brmid1 pre- driver high side 2 hsbc2 hs2 brmid2 pre- driver low side 1 ls1 ls2 gnd rc-osc. 300khz f rc external communication interface io0 io1 io2 io3 io4 io5 pre-driver control vdd5v ref. mux por mux cp i/o register gnd sw0 cp pre- driver low side 2 sw6 sw7 sw1 sw2 sw3 sw4 sw5 shnt_l 12v ref gnd gnd ps cwd analog watchdog reset sw0 ? sw7 vs/2 sw7 vs/2 sw6 brmid1 sw0 brmid2 sw1 diff. amp diff. amp rtg clko vs/2 brmid2 vs/2 brmid1 sw2 diff. amp multi purpose i/o
mlx81100 dc-motor controller mlx81100 ? product abstract page 5 of 19 june 2012 rev 021 2. electrical characteristics 2.1 operating conditions following characteristic is valid over the temperat ure -40deg c125deg c a reduction of c hip internal power dissipation with external supply tra nsistor is obligatory. the extended temperature ran ge is only allowed for a limited periods of time, custome rs mission profile has to be agreed by melexis as a n obligatory part of the part submission warrant (psw ). some analogue parameter will drift out of limits , but chip function can be guaranteed.
mlx81100 dc-motor controller mlx81100 ? product abstract page 6 of 19 june 2012 rev 021 2.2 absolute maximum ratings exceeding the absolute maximum ratings may cause pe rmanent damage. exposure to absolute-maximum- rated conditions for extended periods will affect d evice reliability. parameter symbol condition limit unit min max batterysupplyvoltage vbat beforereversepolarity protection 0.5 20 v vbat loaddump,t<500ms 0.5 45 vbat jumpstart,t<2min [1] 0.5 28 inputsupplyvoltage vs afterreversepolarity protection 0.5 18 inputvoltage vdd5v 0.5 6.5 outputvoltage v1v8 0.5 2.2 outputvoltage rtg 0.5 6.5 shuntmeasurement shnt_l 0.5 vdd5v+0.5v switchinputs sw[7:0] 0.5 vbat linbus lin t<500ms 24 vbat drivervoltage vdrv 0.5 vbat digitalios io[5:0],ti[1:0], to,clko 0.5 vdd5v+0.5v watchdogcap cwd 0.5 vdd5v+0.5v highsidedriverbridge hs1,hs2 0.5 vbat+vdrv highsidebridgecap hsbc1,hsbc2 0.5 vbat+ vdrv midpointsofbridge brmid1,brmid2 0.5 vbat lowsidedriverbridge ls1,ls2 0.5 vdrv storagetemperature tstg 55 150 degc junctiontemperature tj seetextnote(*)below 40 150(155*) thermalresistanceqfn406x6 rth 40 k/w thermal resistancetqfp ep48l rth 40 [1]jumpstartvoltage:thisoperationconditionnee dscarefulhandlingofpowerdissipationbyapplica tionsoftware,topreve nt chipsoverheating,seealsojumpstartinterruptdes cription table 2 - absolute maximum ratings
mlx81100 dc-motor controller mlx81100 ? product abstract page 7 of 19 june 2012 rev 021 3. application circuitry 3.1 single dc-motor drive in this sample application the ic can drive a dc mo tor via an external power n- fet's bridge. the high side n-fet drive is done by a bootstrap output stage. cu rrent control of the motor is done via shunt measurement; the reverse polarity protection of the bridge has to be realized with an external power f et connected to the ground line. short circuits of th e bridge will be detected from fast comparators and in this case the bridge will be switched off. weak short ci rcuits should be monitored with the help of an exte rnal temperature sensor. the actual position can be read with hall sensors, which are connected to the timer capture inputs. th e hall sensors are switched off during standby mode via a switch-able battery voltage output ps. optional it is possible to connect an external serial eeprom via s erial interface in case the usage of an integrated memory is forbidden by safety reasons. figure 2 - application circuitry for single dc-moto r control vs vdd5v v bat mlx81100 sw0 sw2 lin gnd_lin gnd_d v bat ls1 m hs2 brmid2 vdrv hsbc1 ls2 io5 io4 gnd_drv gnd_a gnd shnt_l brmid1 hs1 hsbc2 v1v8 ps sw1 sw3 sw4 sw5 sw6 sw7 io0 io1 io2 io3 lin cwd ti0 ti1 to v bat v cc v cc reverse polarity protection shunt temperature sensor hall sensor v cc rtg clko mlx 90316 spi interface 100nf 100n 47uf 4.7?10uf 1uf 100n 100nf 100nf 100nf c wd 180p 10
mlx81100 dc-motor controller mlx81100 ? product abstract page 8 of 19 june 2012 rev 021 3.2 higher vcc loads and higher ambient temperature s for higher power consumption caused by higher vbat or higher ambient temperatures, an external regulator transistor can bring the main power consu mption which is caused by regulator, outside of the mlx81100 - so maximum chip temperature can be decre ased to meet application needs. figure 3 - application for higher vcc loads and hig her ambient temperatures 3.3 high side reverse polarity protection a high side full bridge reverse polarity protection can also be realised using the below schematics. figure 4 - high side n-fet reverse polarity protect ion mlx81100 v bat clko
mlx81100 dc-motor controller mlx81100 ? product abstract page 9 of 19 june 2012 rev 021 3.4 connection to external can controller if the application requires a connection to the can network it can be realized with the help of an ext ernal can communication cpu. the following circuitry show s a sample how to implement this together with our mlx81100. the communication between mlx8100 and external can controller is done via the spi interface of the melexcm. a bus wake-up will be signalised at the inh pin of the can transceiver. this signal will be used from a normal hv-io pin to wake-up the mlx81100. figure 5 - connection to external can controller sw4 io0 io1 io2 io3 lin io4 can transceiver ( tja 1050 ) canl canh can controller ( mcp 2515) clk si so cs_1 int_1 io5 v cc rxd txd inh v cc sw7
mlx81100 dc-motor controller mlx81100 ? product abstract page 10 of 19 june 2012 rev 021 3.5 dual dc-motor drive in this sample application the ic realizes driving of 2 dc motor via an external power n-fets bridge. the high side n-fet driving is done with a bootstrap ou tput stage. the current control of the motor is don e via shunt measurement; the reverse polarity protection of the bridge must be realized with an external pow er fet connected to ground. short circuit of the bridg e will be detected with internal fast comparators a nd in this case the bridge will be switched off. weak short circuits are monitored with an external temperature sensor. the actual position can be read with hall sensors, which are connected to the timer capt ure inputs. the hall sensors are switched off durin g standby mode via a switch-able battery voltage outp ut vs. if there is a need to synchronize the motor movement via longer distances it can be done via th e serial interface connected to an external high sp eed can transceiver as a physical layer. via this interface together with a proprietary prot ocol it is possible that both motor drivers exchange real t ime position information. optional it is possible t o connect an external eeprom via serial interface, if the app lication can not use internal memories. this extern al memory will be completely stay under api control by using pins of a digital port to create needed sign al waveforms for eeprom. figure 6 - application circuitry for a dual dc-moto r system vs vdd5v v bat mlx81100 sw3 gnd gnd v bat ls1 m hs2 brmid2 vdrv hsbc1 ls2 io5 io4 gnd gnd sw2 gnd shnt_l brmid1 hs1 hsbc2 v1v8 ps sw4 sw5 sw6 sw7 sw0 sw1 io0 io1 io2 io3 lin cwd ti0 ti1 to serial eeprom vcc sdin sdout cs sclk vs vdd5v v bat mlx81100 sw3 gnd gnd v bat ls1 m hs2 brmid2 vdrv hsbc1 ls2 io5 io4 gnd gnd sw2 gnd shnt_l brmid1 hs1 hsbc2 v1v8 ps sw4 sw5 sw6 sw7 sw0 sw1 io0 io1 io2 io3 lin cwd ti0 ti1 to hs-can transceiver (tja1041) txd rxd stb vcc vbat hs-can transceiver (tja1041) txd rxd stb vcc vbat canh canl canh canl v bat v bat inh v cc v cc v cc v cc optional serial eeprom if needed for security reason high speed comunication interface with propietary protocol temperature sensor temperature sensor hall sensor hall sensor reverse polarity protection shunt reverse polarity protection shunt v cc v cc vcc en rtg rtg clko clko 100nf 100nf 100nf 100nf 100nf 4.7 ..10uf 47uf 1uf 1uf 47uf 100nf 100nf 100nf 100nf 4.7 ..10uf 100nf 100nf 100nf c wd c wd 180p lin 10 application example for dual dc motor driver
mlx81100 dc-motor controller mlx81100 ? product abstract page 11 of 19 june 2012 rev 021 3.6 human interface device with dc-motor in this sample application the ic can realize the d riving of a feedback dc motor via an external power n-fet bridge. the high side n-fet driver is created with a bootstrap output stage. the current control of th e motor is done via shunt measurement and the reverse polar ity protection of the bridge must be realized with an external power fet connected to the ground line. short circuits of the bridge will be detected from fast comparators and in this case the bridge will b e switched off. weak short circuits are monitored with an exte rnal temperature sensor. detecting rotation directi on and positions of a rotating encoder can be easy done vi a the timer capture inputs. the 6 high voltage pins sw[n] make it possible to implement a switch matrix up to 3x3 or 6 single switches. figure 7 - application circuitry for human interfac e device with dc-motor vs vdd5v v bat mlx81100 sw3 sw4 lin gnd gnd v bat ls1 m hs2 brmid2 vdrv hsbc1 ls2 sw1 sw0 gnd gnd sw2 gnd shnt_l brmid1 hs1 hsbc2 v1v8 ps sw5 sw6 sw7 io4 io5 io0 io1 io2 io3 lin cwd ti0 ti1 to rotation- encoder vcc v bat v cc reverse polarity protection shunt temperature sensor v cc rtg clko 100nf 100nf 100nf 100nf 100nf 100nf 4.7 ..10uf 47uf 1uf c wd 180p 10
mlx81100 dc-motor controller mlx81100 ? product abstract page 12 of 19 june 2012 rev 021 3.7 seat heating and climatisation in this sample application the ic drives 2 separate heat elements via high side drivers and 2 motors v ia the low side drivers. the high side n-fet driving is do ne with a bootstrap output stage. the current contr ol of the high side fet is realized via shunt measurement and the shunt voltage is amplified with a differen tial amplifier connected to the adc. the reverse polarity protection of the low side fet must be realized with an external power fet connec ted to the ground line. short circuits of the single fe t will be detected with integrated comparators and in this case the fet will be switched off. weak short circu its must be monitored with an external temperature sensor. figure 8 - application circuitry for seat heating a nd seat climatisation vs vdd5v v bat mlx81100 sw0 lin gnd gnd ls1 hs2 brmid2 vdrv hsbc1 ls2 sw1 gnd gnd gnd shnt_l brmid1 hs1 hsbc2 v1v8 ps sw4 sw5 sw7 sw6 io4 io5 io0 io1 io2 io3 lin cwd ti0 ti1 to shunt heater 2 v bat shunt heater 1 v bat fan 1 v bat m v bat m fan 2 v bat v cc rtg clko sw2 sw3 100nf 100nf 100nf 100nf 100nf 100nf 1uf 47uf 4.7 ..10uf c wd 10 180p
mlx81100 dc-motor controller mlx81100 ? product abstract page 13 of 19 june 2012 rev 021 4. pin description pin of qfn package pins analog ic pads digital ic pads pin name voltage range remarks and description pin of tqfp 36 1 1 0 vs pwr hv battery supply voltage; external protection against reverse polarity needed 42 4,31,22, 3,37 5 6 2 gnd pwr hv ground: digital, analogue, lin, driver, pads: vssli n, vssdrv,vssio,vssa,vssd / (psub at tqfp only) 5,35,26,20 ,43,3,4 40 1 2 1 vdd5v pwr lv input from regulator (5 v), external blocking capacitors 46 38 1 1 2 v1v8 pwr lv regulator output (about 1.8 v), external blocking capacitors 44 39 1 1 0 rtg an hv external regulator transistor control output, to be connected to vdd5v or external n-type transis tor 45 33 1 1 0 ps pwr hv switch-able supply (vs) output v oltage, internal clamped 39 13,14,16 -21 8 8 0 sw[7:0] multifunc hv high voltage i/o port with wake-up function, config urable 15,17-19 21-24 35 1 1 0 cwd an lv watch dog load capacitor 41 11 1 1 0 shnt_l an lv shunt measurement connection for adc 13 26,27 2 2 0 ls1, ls2 an hv gate driver for external n-channel mosfet in low-si de configuration 30,31 24,29 2 2 0 hs1, hs2 an hv gate driver for external n-channel mosfet in high-s ide configuration 28,33 32 1 1 0 vdrv an hv regulator output, internal clamped, for pre-chargin g of bootstrap capacitors of the high side gate driver 38 23,30 2 2 0 hsbc1,hsbc2 an hv connection of bootstr ap capacitors 27,34 25,28 2 2 0 brmid1,brmid2 an hv midpoint of a full bridge (usually the source of hi gh-side fet and drain of it?s low-side fet) 29,32 7 1 1 0 lin an hv lin transceiver bus pin 9 34 1 1 0 clko dig 5v clock 307khz for possible external charge pump or c hip select/input 40 2,8,12, 9,6,1 6 0 6 io[5:0] dig lv digital io (melexcm) 2,10,14, 11,7,1 10,15 2 0 2 ti[1:0] test input test inputs for melexis (melexcm) - connect to gnd 12,16 5 1 0 1 to test output test output for melexis (melexcm), unconn. in appli cation 6 qfn40 tqfp48 io(0) io(5) vssa vsslin to io(1) lin io(4) io(2) ti(1) hsbc2 hs2 brmid2 ls2 ls1 brmid1 hs1 hsbc1 vssio sw (0) vdd5v rtg v1v8 vssd vs cwd clko ps vdrv vssdrv 40 shnt_l io(3) sw(7) sw(6) ti(0) sw(5) sw(4) sw(3) sw(2) sw(1) 1 hsbc2 hs2 brmid2 ls2 ls1 brmid1 hs1 hsbc1 vssio sw(0) vdd5v rtg v1v8 vssd vs cwd clko ps vdrv vssdrv 48 shnt_l io(3) sw(7) sw(6) ti(0) sw(5) sw(4) sw(3) sw(2) sw(1) io(0) io(5) vssa vsslin to psub lin io(4) io(2) ti(1) vdd5v io(1) vssd nc. nc. nc. nc. nc. 1
mlx81100 dc-motor controller mlx81100 ? product abstract page 14 of 19 june 2012 rev 021 pin of qfn package pins analog ic pads digital ic pads pin name voltage range remarks and description pin of tqfp dig= digital input, output ,bidir / an= analogue pi n / pwr= power/supply pin multifunc= multifunctional pin (configurable pin) / test= pin for test purposes lv= low volt, vdd5v or v1v8 related / hv= high vol tage, vbat or vs related
mlx81100 dc-motor controller mlx81100 ? product abstract page 15 of 19 june 2012 rev 021 5. mechanical specification 5.1 qfn 6x6 40 sawn a a1 a3 d d d2 e e2 e l n nd ne k min 0.80 0.00 0.20 0.18 6.00 4.00 6.00 4.30 0.50 0.45 40 10 10 0.20 nom 0.85 0.02 0.25 4.40 4.40 0.50 max 0.90 0.05 0.30 4.50 4.50 0.55 1.dimensionsandtolerancesconformtoasmey14.5m 1994 2.alldimensionsareinmillimeters.allangelsar eindegrees 3.nisthetotalnumberofterminals 4.dimensionbappliestometallicterminalandis measuredbetween0.15and0.30mmfromterminaltip. iftheterminalhasthe optionalradiusontheotherendoftheterminal,t hedimensionbshouldnotbemeasuredinthatradiu sarea 5.ndandnerefertothenumberofterminalsonea chdandesiderespectively depopulationispossibleinasymmetricalfashion exposed pad need best possible contact to ground for exlectrical and thermal reasons
mlx81100 dc-motor controller mlx81100 ? product abstract page 16 of 19 june 2012 rev 021 5.2 tqfp 7x7 ep 48l a a1 a2 b b1 d d1 d2 e e1 e2 e l n ccc ddd min 0.05 0.95 0.17 0.17 9.00 7.00 5.00 9.00 7.00 5.00 0.50 0.45 48 nom 1.00 0.22 0.20 0.60 max 1.20 0.15 1.05 0.27 0.23 0.75 0.08 0.08 notes: 1. alldimensioningandtolerancesconformtoasmey1 4.5m1994, 2. datumplane[||]locatedatmouldpartinglinea ndcoincidentwithlead,whereleadexists,plastic bodyatbottomof partingline. 3. datum[ab]and[d]tobedeterminedatcentrelin ebetweenleadswhereleadsexist,plasticbodyat datumplane[||] 4. tobedeterminedatseatingplane[c] 5. dimensionsd1ande1donotincludemouldprotrusio n.dimensionsd1ande1donotincludemouldprotru sion.allowable mouldprotrusionis0.254mmond1ande1dimension s. 6. 'n'isthetotalnumberofterminals 7. thesedimensionstobedeterminedatdatumplane[ ||] 8. packagetopdimensionsaresmallerthanbottomdime nsionsandtopofpackagewillnotoverhangbottom ofpackage. 9. dimensionbdoesnotincludedambarprotrusion,al lowabledambarprotrusionshallbe0.08mmtotalin excessofthe"b" dimensionatmaximummaterialcondition,dambarca nnotbelocatedonthelowerradiusofthefoot. 10. controllingdimensionmillimetre. 11. maximumallowablediethicknesstobeassembledin thispackagefamilyis0.38mm 12. thisoutlineconformstojedecpublication95regis trationms026,variationaba,abc&abd. 13. a1isdefinedasthedistancefromtheseatingplan etothelowestpointofthepackagebody. 14. dimensiond2ande2representthesizeoftheexpos edpad.theactualdimensionsarespecifiedionthe bondingdiagram, andareindependentfromdiesize. 1. 15.exposedpadshallbecoplanarwithbottomofpa ckagewithin0.05.
mlx81100 dc-motor controller mlx81100 ? product abstract page 17 of 19 june 2012 rev 021 6. standard information regarding manufacturability o f melexis products with different soldering processes our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test metho ds: reflow soldering smd?s (s urface m ount d evices) ? ipc/jedec j-std-020 moisture/reflow sensitivity classification for nonh ermetic solid state surface mount devices (classification reflow profiles according to table 5-2) ? eia/jedec jesd22-a113 preconditioning of nonhermetic surface mount device s prior to reliability testing (reflow profiles according to table 2) wave soldering smd?s (s urface m ount d evices) and thd?s (t hrough h ole d evices) ? en60749-20 resistance of plastic- encapsulated smd?s to combin ed effect of moisture and soldering heat ? eia/jedec jesd22-b106 and en60749-15 resistance to soldering temperature for through-hol e mounted devices iron soldering thd?s (t hrough h ole d evices) ? en60749-15 resistance to soldering temperature for through-hol e mounted devices exposed pad need best possible contact to ground for exlectrical and thermal reasons
mlx81100 dc-motor controller mlx81100 ? product abstract page 18 of 19 june 2012 rev 021 solderability smd?s (s urface m ount d evices) and thd?s (t hrough h ole d evices) ? eia/jedec jesd22-b102 and en60749-21 solderability for all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature prof ile etc) additional classification and qualificatio n tests have to be agreed upon with melexis. the application of wave soldering for smd?s is allo wed only after consulting melexis regarding assuran ce of adhesive strength between device and board. melexis is contributing to global environmental con servation by promoting lead free solutions. for more information on qualifications of rohs compliant products (rohs = european directive on t he restriction of the use of certain hazardous substances) please vis it the quality page on our website: http://www.melexis.com/quality.aspx
mlx81100 dc-motor controller mlx81100 ? product abstract page 19 of 19 june 2012 rev 021 7. disclaimer devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no war ranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. melexis reserves the right to change specifications and prices at any time and without n otice. therefore, prior to designing this product into a system, it is necessary to check wit h melexis for current information. this product is intended for use in normal commercial ap plications. applications requiring extended temperature range, unusual environmental r equirements, or high reliability applications, such as military, medical life-suppor t or life-sustaining equipment are specifically not recommended without additional pro cessing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall not be liable to recipient or any thi rd party for any damages, including but not limited to personal injury, property damage, loss o f profits, loss of use, interrupt of business or indirect, special incidental or consequ ential damages, of any kind, in connection with or arising out of the furnishing, p erformance or use of the technical data herein. no obligation or liability to recipient or any third party shall arise or flow out of melexis? rendering of technical or other services. ? 2012 melexis nv. all rights reserved. for the latest version of this document, go to our website at www.melexis.com or for additional information contact melexis direc t: europe, africa, asia: america: phone: +32 1367 0495 phone: +1 248 306 5400 e-mail: sales_europe@melexis.com e-mail: sales_usa @melexis.com iso/ts 16949 and iso14001 certified

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